Cost-effectiveness and precisionCutting and sawing

We offer a range of processes for cutting and sawing brittle and hard materials, such as silicon, various types of glass and ceramics. Depending on the requirements and the field of application, the advantages of each method must be weighed up and the appropriate one selected. The most important and decisive factors here are cost-effectiveness and the desired or required quality.

ID sawing

For high standards of precision, surface finish and plane parallelism when cutting and sawing hard, brittle materials, annular or inner-diameter (ID) cutting or sawing is ideally suited. With this specialised method, particularly narrow cutting widths can be obtained with very slim kerf, as are required for the manufacturing of silicon or germanium wafers and in optical applications. At the same time, ID sawing permits a high degree of material efficiency, as the material loss during sawing is very low compared with other methods.

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Bandsawing

Bandsawing is particularly suitable for cutting and portioning large-scale block material and semi-finished products made of hard and brittle materials, such as silicon, ceramics and glass. As an established standard method, bandsawing, alongside peripheral (OD) sawing, permits a high degree of cost-effectiveness by coupling high speed with corresponding precision. Examples of typical applications are the portioning and bricking of multicrystalline silicon or the cropping and squaring of monocrystalline silicon.

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Rotary sawing

Rotary sawing, which is gentle on the material, is used particularly in cases where relatively large workpieces made of sensitive and hard, brittle materials, such as polysilicon, glass or various ceramics, have to be cut. The clamped workpiece rotates around its own axis, thus being fed to the counter-rotating cutting edge of the saw. This machining method requires particularly precise working, necessitating extensive experience in handling the materials concerned.

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